TOKYO, Sept. 10, 2026 /Kyodo JBN/ --
Taiyo Holdings Co., Ltd.Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers - Paper Presented at IEEE ESTC 2026, International Conference on Semiconductor- and Electronic Device-packaging Technologies and Related Materials - Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter "Taiyo Holdings"), based in Tokyo, presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2…READ FULL ARTICLE
